PANTECH TAPE CO., LTD. Phone: 886-3-475 8949, Fax: 886-3-475 8957, sales@pantechtape.com, http://pantechtape.com, No. 8, Alley 98, Lane 800, Chung Shan South Road, Yangmei, Taoyuan 32669, Taiwan

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Grinding Tape for bumpered IC,  UB265


  

PanTech UB265 is an ultra-thick adhesive UV tape, specially designed for back grinding process of gold bumper and solder bumper IC chips. It is made of PO film with ultra-thick 165µ adhesive, which can ensure the embedding of the bumper balls deeply into the adhesive layer during back grinding process.

It is RoHS and halogen free.

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Characteristics:

Catalog No.

UB265

Substrate

expandable PO film

Thickness, substrate

0.080 mm

Adhesive thickness

0.165 mm

Thickness, total

0.245 mm

Tensile Strength

9 kg/in.

Elongation

600 %

Liner

0.05mm PET release liner

Adhesion, as received, to SUS

600 g/in.

After UV365nm, 300 mJ/cm2

  16 g/in.

Shelf life: 6 months, storage in dry cool space and avoid direct sunlight.