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Grinding Tape for bumpered IC, UB265
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PanTech UB265 is an ultra-thick adhesive UV tape, specially designed for back grinding process of gold bumper and solder bumper IC chips. It is made of PO film with ultra-thick 165µ adhesive, which can ensure the embedding of the bumper balls deeply into the adhesive layer during back grinding process. It is RoHS and halogen free. |
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Characteristics:
Shelf life: 6 months, storage in dry cool space and avoid direct sunlight. |