Pantech Tape Co., Ltd. Wafer Dicing UV tape, UE802

class 100 coating foundry, since 1984

Wafer Dicing UV TAPE UE802

PanTech UE802, is an UV Dicing Tape, specially designed for dicing of silicon wafer. It sustains a suitable adhesion during dicing and can be easily picked up after UV exposure.

It is RoHS and halogen free.

Characteristics:

Catalog No.	UE802
Substrate	PO film
Thickness, substrate	0.08 mm
Thickness, Adhesive	0.01 mm
Thickness, total	0.09 mm
Tensile Strength	7 kg/in.
Elongation	600 %
Liner	0.05mm PET release liner
	to steel	to grinding silicon	to polished silicon
Adhesion, as received	450 g/in.	450 g/in.	450 g/in.
After UV365nm, 200 mJ/cm²	7 g/in.	7 g/in.	7 g/in.

Shelf life: 6 months, storage at dry cool space avoid direct sunlight.