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UV TAPE   UP801

          PanTech UP 801, is a PO based UV off tape, specially designed for wafer grinding, dicing and as a supporting tape for flexible printed circuit. It sustains a strong adhesion during dicing and grinding and can turn to very low adhesion after UV exposure, then easily peeled off from wafer or FPCs.

         It is RoHS and ion free.

               

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Characteristics:

Catalog No.

UP801

Substrate

PO film

Thickness, substrate

0.08 mm

Thickness, total

0.100 mm

Tensile Strength

8 kg/in.

Elongation

800 %

Liner

0.05mm PET release liner

 

to steel

to silicon

to glass

Adhesion, as received

170 g/in.

110 g/in.

130 g/in.

After UV365nm, 200 mJ/cm2

65 g/in.

0 g/in.

15 g/in.

Shelf life: 6 months, storage at dry cool space avoid direct sunlight.

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