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Wafer Dicing UV TAPE

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PanTech Wafer Dicing UV tape is an adhesive tape specially designed for dicing of Silicon Wafers. It sustains a suitable adhesion and turns to very low adhesion after UV exposure. It assures no chip flying during dicing process and can be picked up easily after UV exposure.

It is RoHS and halogen free.

　

Categories:

Suitable for	Silicon Wafer Dicing
Catalog No.	UB801	UP802A	UE802
Base film	expandable PO	PO	expandable PO
Thickness of Base film, mm	0.080	0.080	0.08
Thickness of Adhesive, mm	0.005	0.005	0.01
Total Thickness, mm	0.085	0.085	0.09
Tensile Strength, Kg/in	8	8	7
Elongation	800%	800%	600%
Thickness, PET release liner, mm	0.05	0.05	0.05
Adhesion, g/in
As received, To SUS	300	400	450
after UV 200mJ/cm², to SUS	9	3	7
as received, to grinding Si wafer	320	400	450
after UV 200mJ/cm², to grinding Si	9	7	7
as received, to polished Si wafer	360	420	450
after UV 200mJ/cm², to polished Si	11	3	7

          * Storage under cool dry place, avoid direct sunlight, use before 6 months.