PANTECH TAPE CO., LTD. Phone: 886-3-475 8949, Fax: 886-3-475 8957, sales@pantechtape.com, http://pantechtape.com, No. 8, Alley 98, Lane 800, Chung Shan South Road, Yangmei, Taoyuan 32669, Taiwan

                     class 100 coating foundry,      since 1984

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Back Grinding Tape, BG205

http://pantechtape.com/product/uvtape/bump1.png   http://pantechtape.com/product/uvtape/bump1.png

PanTech BG205 is a back grinding Tape of IC chips. It is made of special PO film with special adhesive, which can ensure the embedding of the bumper balls deeply into the adhesive layer during back grinding process, and removal without residuals afterward.

It is RoHS and halogen free.

　

Characteristics:

Catalog No.

BG205

Substrate

Special PO1

Thickness, substrate

0.160 mm

Adhesive

SR2

Adhesive thickness

0.045 mm

Thickness, total

0.205 mm

Tensile Strength, MD

9.3 kg/in.  (73N/20mm)

                               TD

8.5 kg/in.  (65N/20mm)

Elongation, MD

800 %

                     TD

900 %

Liner

0.05mm PET release liner

Adhesion, to PI

240 g/in. (1.9N/20mm)

Adhesion, to Si

175 g/in. (1.4N/20mm)

Standard length

50M

Shelf life: 6 months, storage in dry cool space and avoid direct sunlight.