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UV TAPE


PanTech UV tape, also called as UV off tape is an adhesive tape specially designed for dicing of wafer, LED module, QFN, glass IC chips, and package sawing singulations. It sustains a strong adhesion and turns to very low adhesion after UV exposure. This tape can hold the chips firmly during dicing, and chips can be picked up or peeled off easily after UV exposure.

These are all RoHS and halogen free.

 

Dicing Tape

for PCB

Wafer Dicing Tape

Dicing tape

for glass

Gold/Solder Bumper IC Back Grinding

 

Categories:

Category

 

Dicing

Back Grinding

Usages | base film

Adhesion

140µ PE

130µ/140µ PO

80µ PO

130/140µ PO

100µ PO

80µ PO

100µ PET

80µ PO

PCB dicing

 

QFN dicing

ultra-

strong

UP153

UP163-H24

UP163

UP183

 

UB163

   

UT1007

 

strong

UP150

UP163-20

       

UT1005

 

glass dicing

 

Ceramic IC dicing

strong

 

UP163-20

UP151

UP821

UP822

UB163-20

 

UB815 

   

medium

 

UP1608

UP1808

UP804

UB151

UE152

UB130

UE130

     

Solder/Gold bumper grinding

 medium low

             

UK265

ultra thick adhesive

Silicone Wafer Dicing

low

 

 

UP803

   

UB802

UB807

   

cut depth

 

Deep

Deep

Shallow

Deep

 

Shallow

 

Back Grinding

Expandable/Recovery

 

No

No

No

Yes

Yes

Yes

No

Yes

Color

 

transparent

matt

matt

matt

matt

matt

transparent

matt

Advantage

 

see through

soft,

conformable

clean removal

clean removal

Expandable

Expandable Expandable

excellent Temp. R.

ultra thick adhesive for bumper IC back grinding

Disadvantage

 

Bad Temp. R.

 

 

     

use in dark room