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UV TAPE


PanTech UV tape, also called as UV off tape is an adhesive tape specially designed for dicing of wafer, LED module, QFN, glass IC chips, and package sawing singulations. It sustains a strong adhesion and turns to very low adhesion after UV exposure. This tape can hold the chips firmly during dicing, and chips can be picked up or peeled off easily after UV exposure.

These are all RoHS and halogen free.

 

Dicing Tape

for PCB

Wafer Dicing Tape

Dicing tape

for glass

 

Categories:

Usage/base film

Adhesion

130µPO

80µPO

140µPO

80µPO

100µPET

QFN Dicing 

PCB Dicing

Ultra high

UP163-H24

UP163

 

 

 

UT1005

Glass Dicing

Ceramic Dicing

Strong

UP163-20

UP151

UP821

UB163-20

UB151

 

 

Wafer Dicing

low

 

UP802

UP804

 

UB802

 

Expandable/

recovery

 

No

No

Yes

Yes

No

color

 

matt

matt

matt

matt

Clear

Advantage

 

clean removal

clean removal

Expandable

Expandable

excellent Temp. R.

Stiffness

Disadvantage

 

 

 

 

 

Stiffness