Pantech Tape Co., Ltd. UV tape

class 100 coating foundry since 1984

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UV TAPE

PanTech UV tape, also called as UV off tape is an adhesive tape specially designed for dicing of wafer, LED module, QFN, and various kinds of IC chips, and as a supporting tape for flexible printed circuit. It sustains a strong adhesion and turns to very low adhesion after UV exposure. This tape can hold the chips firmly during dicing, and chips can be shaken or peeled off easily after UV exposure.


UV Dicing Tape	Supporting tape

　

Characteristics:

Catalog No.	UP801	UP802	UP150	UP160	UP1608	UP163	UV1002
Substrate	PO	PO	PE	PE	PO	PO	PET
Substrate thickness	0.08 mm	0.08 mm	0.14 mm	0.14 mm	0.14 mm	0.14 mm	0.10 mm
Adhesive thickness	0.02 mm	0.02 mm	0.01 mm	0.02 mm	0.02 mm	0.03 mm	0.02 mm
Total thickness	0.10 mm	0.10 mm	0.15 mm	0.16 mm	0.16 mm	0.17 mm	0.12 mm
Tensile strength	8 kg/in.	8 kg/in.	8 kg/in.	8 kg/in.	14 kg/in.	14 kg/in.	>20kg/in.
Elongation	800%	800%	1,000 %	1,000%	600%	600%	150%
Release liner, PET	0.050mm	0.050mm	0.050mm	0.050mm	0.050mm	0.050mm	0.050mm
Adhesion
before UV, to steel	170 g/in	450 g/in	950g/in	500g/in	780g/in	2,200g/in	750 g/in
after UV, to steel, 200mJ/cm²	65 g/in	45 g/in	95 g/in	70 g/in	30 g/in	15 g/in	20 g/in
before UV, to glass	130 g/in	50 g/in	1,200 g/in	13 g/in	550 g/in	2,200 g/in	8 g/in
after UV, to glass, 200mJ/cm²	15 g/in	24 g/in	40 g/in	6 g/in	15 g/in	20 g/in	2 g/in
before UV, to silicon	110 g/in	40 g/in	1,450 g/in	13 g/in	600 g/in	2,200 g/in	8 g/in
after UV, to silicon, 200mJ/cm²	0 g/in	0 g/in	40 g/in	0 g/in	15 g/in	35 g/in	0 g/in