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UV Dicing TAPE for Glass, Shallow Cut

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PanTech  UV Dicing tape for Glass IC Shallow Cut is an adhesive tape specially designed for dicing of  glass or ceramic IC chips which do not need deep cut. It sustains a strong adhesion and turns to very low adhesion after UV exposure. This tape can hold the chips firmly during dicing, and can be removed easily after UV exposure.

It is RoHS and halogen free.

　

Categories:

Suitable for	Dicing of Glass / Ceramic IC modules, Shallow cut
Catalog No.	UP821	UP822
Base film	PO	PO
Thickness of Base film, mm	0.08	0.08
Thickness of Adhesive, mm	0.03	0.04
Total Thickness, mm	0.11	0.12
Tensile Strength, Kg/in	8	8
Elongation	800%	800%
Thickness, PET release liner, mm	0.05	0.05
Adhesion, g/in
As received, To SUS	1,900	2,200
after UV 200mJ/cm², to SUS	30	50
as received, to glass
after UV 200mJ/cm², to glass

          * Storage under cool dry place, avoid direct sunlight, use before 6 months.