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UV Dicing TAPE for PCB

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PanTech PCB Dicing UV tape is an adhesive tape specially designed for dicing of  LED module, QFN, glass IC chips, and various kinds of PCB modules. It sustains a strong adhesion and turns to very low adhesion after UV exposure. This tape can hold the chips firmly during dicing, and chips can be picked up or peeled off easily after UV exposure. Some of them need ultra high adhesion to the chips.

It is RoHS and halogen free.

PCB Dicing

QFN Dicing

　

Categories:

Suitable for	Dicing of PCB/QFN module
Catalog No.	UB163	UP163-45	UP163	UP164	UP183
Base film	expandable PO	PO	PO	PO	PO
Thickness of Base film, mm	0.14	0.14	0.14	0.13	0.14
Thickness of Adhesive, mm	0.03	0.045	0.03	0.03	0.03
Total Thickness, mm	0.17	0.185	0.17	0.16	0.17
Tensile Strength, Kg/in	14	14	14	14	14.
Elongation	600%	600%	600%	600%	600%
Thickness, PET release liner, mm	0.05	0.05	0.05	0.05	0.05
Color	matt	matt	matt	matt	matt
Adhesion, g/in
As received, To SUS	2,000	2,700	2,200	1,900	2,000
after UV 300mJ/cm², to SUS	30	50	15	35	30
as received, to Si wafer		2,400	2,200		1,500
after UV 300mJ/cm², to Si		35	35		26
as received, to glass	2,000	2,400	2,200		1,700
after UV 300mJ/cm², to glass	20	35	20		20

          * Storage under cool dry place, avoid direct sunlight, use before 6 months.