PANTECH TAPE CO., LTD. Phone: 886-3-475 8949, Fax: 886-3-475 8957,,, No. 8, Alley 98, Lane 800, Chung Shan South Road, Yangmei, Taoyuan 32669, Taiwan

                     class 100 coating foundry,      since 1984

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Grinding Tape for bumpered IC,  BG265


PanTech BG265 is an ultra-thick adhesive UV tape, specially designed for back grinding process of gold bumper and solder bumper IC chips. It is made of PO film with ultra-thick 165µ adhesive, which can ensure the embedding of the bumper balls deeply into the adhesive layer during back grinding process.

It is RoHS and halogen free.



Catalog No.



expandable PO film

Thickness, substrate

0.080 mm

Adhesive thickness

0.165 mm

Thickness, total

0.245 mm

Tensile Strength

9 kg/in.


600 %


0.05mm PET release liner

Adhesion, as received, to SUS

600 g/in.

After UV365nm, 300 mJ/cm2

16 g/in.

Shelf life: 6 months, storage in dry cool space and avoid direct sunlight.