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Back Grinding Tapes

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PanTech Back Grinding Tape Series are specially designed for the protection of IC chips during back grinding processes. It is made of special film with special adhesive, which can ensure the embedding of the bumper balls deeply into the adhesive layer during back grinding process without damage, and removal without residuals afterward. It is RoHS and halogen free.

Categories:

Catalog No.	BG205	BG265
Type	no need of UV	UV tape
Base film	special PO1	special PO2
Thickness of Base film, mm	0.160	0.160
Intermediate layer	-	SR1
Thickness of Intermediate layer, mm	-	0.060
Face Adhesive	SR2	SR3
Thickness of Adhesive, mm	0.045	0.045
Total Thickness, mm	0.205	0.265
Tensile Strength, MD, Kg/in	9	9
Elongation, MD	800%	600%
Thickness, PET release liner, mm	0.05	0.05
Adhesion, To SUS, as received	240g/in (1.9N/20mm)	600g/in.(4.6N/20mm)
Adhesion, after UV 300mJ/cm², to SUS	-	16 g/in.(0.1N/20mm)

          * Storage under cool dry place, avoid direct sunlight, use before 6 months.