Pantech Tape Co., Ltd. Wafer Dicing UV tape, UB805

class 100 coating foundry, since 1984

Wafer Dicing UV TAPE UB802

PanTech UB802, is an UV Dicing Tape, specially designed for dicing of silicon wafer. It is coated with UV adhesive on a specially formulated PO film. It sustains a suitable adhesion to ensure no chip flying during dicing and can then be easily picked up cleanly after UV exposure.

It is RoHS and halogen free.

Characteristics:

Catalog No.	UB802
Substrate	PO film
Thickness, substrate	0.080 mm
Thickness, adhesive	0.010 mm
Thickness, total	0.090 mm
Tensile Strength	8 kg/in.
Elongation	800 %
Liner	0.05mm PET release liner
	to steel	to grinding silicon	to polished silicon
Adhesion, as received	320 g/in.	320 g/in.	300 g/in.
After UV365nm, 300 mJ/cm²	7 g/in.	7 g/in.	7 g/in.

Shelf life: 6 months, storage at dry cool space avoid direct sunlight.